ASIC • Hybrids • Ceramic substrates • System in package
RF Hyper MMIC • Power module
Design office
Design et industrialisation
Testing laboratory
Electrical and environmental
ASIC, Hybrids
Mixed-signal integrated circuits, analogue and digital
Specific applications: high T°, radiation, etc.
Cloning of obsolete components
DFM / Process brick development
Wafer cutting, chip placement, bonding, etc.
Hermetic/plastic packaging
Special processes
Strategic storage
Outsourcing or sovereign supply chain
20 million parts per year (ASICs)
Environmental screening
Development of electrical tests
Electrical characterisation and testing in production
Failure analysis and expertise
Reliability and Qualification of batches (test design and performance)
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