Circuit board assembly line audit

INTRODUCTION

• Industrial environment
• Reliability issues

SOLDERING

• Soldering
• Lead solder
• Wettability
• Intermetallic
• Phase evolution
• RoHS and REACH
• Control
• Lead-free solder
• Leaded and lead-free solder
• Whiskers

PRINTED CIRCUIT BOARDS AND MAIN ELECTRONIC COMPONENTS

• Printed circuit boards
• Capacitors
• Quartz
• Plastic-cased components

PCB ASSEMBLY LINE

• Process Flow
• SMD line
• Through-hole components (PTH) only
• 1-sided SMD components
• 1-sided SMD components + some
• PTHs
• Pin In Paste
• SMD components on 2 sides
• SMD and through-hole: mixed technology

ELECTROSTATIC DISCHARGES

• EOS and ESD
• Component sensitivity
• Workshop environment
• Transport of sensitive parts
• Checking fixtures

INTRODUCTION TO PROCESS CONTROL

• Qualification
• Parameter controls
• SPC, CP, CPK, control chart

AUDIT TECHNIQUE

• General
• Preparation
• Organization
• Agenda
• Attitude
• On-line procedure

FINALIZING THE AUDIT

• Audit grid
• Wrap up

DESCRIPTION AND DETAILED AUDIT OF ASSEMBLY PROCESS STEPS

• Cleanliness and visual management
• Receiving and storage
• Screen printing
• Report
• Reflow
• Control
• Through-hole
• Wave soldering
• Other brazing methods
• Varnish
• Test
• System integration
• Packaging
  

  ANNEXES

• Main standards and acronyms
• Audit digest

Basics knowledge of electronics.

QAF quality engineers, product managers, assembly process technicians, auditors.

Process Engineer Project Manager.

Projection and printed copies of Powerpoint presentations, practical case studies, exercises, situational examples, theoretical examples, video materials, etc.

Evaluation at the beginning and end of the course, quiz…

A training certificate complying with the provisions of Article L. 6353-1 paragraph 2 is issued to the trainee.

5 working days before the start of the course (if OPCO funding)

2023 :

Satisfaction rate: 93

Number of sessions: 3

Number of trainees: 16