Physical analysis of components

ANALYSIS TECHNIQUE APPLIED TO :

• Construction analysis
• Component analysis
• Packaging analysis
• Chip analysis
• Failure analysis
• Components
• Boards

ELECTRICAL TESTING :

• Parametric test
• Fault confirmation
• Comparative measurement

NON-DESTRUCTIVE ANALYSIS :

• Optical visual
• X-ray
• Acoustic microscopy

CHEMICAL OPENING :

• Acids and lasers for opening plastic housings
• Case analysis techniques: specific chemical opening
• SEM inspection, pull test and shear test
• Chemical apertures for failure analysis
• Opening artifacts

MECHANICAL APERTURES :

• Mechanical opening of cavity housings

FAULT LOCATION :

• Optical vision
• Probing
• Detecting hot spots using liquid crystal technology
• Principle of light emission microscopy
• Infrared microscopy

MICRO SECTION :

• Coating for PCB components and solders
• Chips
• Chemical revelations

MEB OBSERVATION :

• Sample preparation
• Observation in secondary and backscatter modes
• EDX analysis technique (Electron Dispersion X-rays analysis)

QUESTIONS

Knowledge of component technology, reliability, assembly, analysis of electronic components and systems.

Technicians, engineers/project managers who have to carry out, monitor, challenge and synthesize analyses of components and boards, in their own or external laboratories.

Laboratory engineers and technicians.

Projected and printed PowerPoint presentation, practical case study, exercises, role-playing, theoretical example, video support…

Evaluation at the beginning and end of training, quizzes, etc.

A training certificate in compliance with the provisions of Article L. 6353-1 paragraph 2 given to the trainee.

5 working days before the start of training (if OPCO funding).

2022 :

Satisfaction rate: 96
Number of sessions: 3
Number of trainees: 12